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重慶萬(wàn)國(guó)半導(dǎo)體科技有限公司_招聘_封裝前段工程部工藝工程師_3人
- 5000-8000元/月
- 工作地點(diǎn):北碚 招 3 人 6-8年工作經(jīng)驗(yàn) 本科學(xué)歷
本崗位***
1. To maintain and improve FOL process quality and capability.
2. To evaluate and release FOL new process/material/equipment for quality improvement and cost reduction.
3.To constantly improve and update the process control documents
4.Create, update FMEA, Process Control Plan, MI per package
5.Optimization parameter of assembly process
6.To promote the coordination of statistical process control (SPC) used in the process of production
7.To provide technical support for online quality control
8.To promote the yield improvement and the reduction in manufacturing cost
plaint handling and action driver
職位要求
機(jī)械或電子等相關(guān)專(zhuān)業(yè),大學(xué)本科或以上學(xué)歷。封裝前段工藝5年以上工作經(jīng)驗(yàn);必須精通封裝前段DP, DA, WB等一個(gè)或者多個(gè)工序工藝流程。
職能類(lèi)別:半導(dǎo)體工藝工程師電氣工程師/技術(shù)員